Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879228 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Chen-Shien Chen | 2020-12-29 |
| 10744207 | Biological complexes and methods for using same | Amy Twite, Sonny Hsiao, Cheng Liu, Hong Liu | 2020-08-18 |
| 10700025 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang +2 more | 2020-06-30 |
| 10692789 | Stacked fan-out package structure | Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Wei-Che Huang | 2020-06-23 |
| 10629509 | Redistribution circuit structures and methods of forming the same | Shang-Yun Tu, Sheng-Yu Wu, Ching-Hui Chen | 2020-04-21 |
| 10629580 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Chen-Shien Chen | 2020-04-21 |