Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10790380 | Semiconductor chip and manufacturing method thereof | Cheng-Tien Wan, Yao-Tsung Huang, Yun-San Huang, Ming-Cheng Lee | 2020-09-29 |
| 10727202 | Package structure | Tzu-Hung Lin, Yu-Hua Huang, Ming-Tzong Yang | 2020-07-28 |
| 10692789 | Stacked fan-out package structure | Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Ching-Wen Hsiao | 2020-06-23 |