Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741469 | Thermal via arrangement for multi-channel semiconductor device | Hsien-Hsin Lin, Wen-Kai Wan | 2020-08-11 |
| 10727202 | Package structure | Tzu-Hung Lin, Yu-Hua Huang, Wei-Che Huang | 2020-07-28 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741469 | Thermal via arrangement for multi-channel semiconductor device | Hsien-Hsin Lin, Wen-Kai Wan | 2020-08-11 |
| 10727202 | Package structure | Tzu-Hung Lin, Yu-Hua Huang, Wei-Che Huang | 2020-07-28 |