Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741469 | Thermal via arrangement for multi-channel semiconductor device | Hsien-Hsin Lin, Ming-Tzong Yang | 2020-08-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741469 | Thermal via arrangement for multi-channel semiconductor device | Hsien-Hsin Lin, Ming-Tzong Yang | 2020-08-11 |