Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867892 | Semiconductor structure and manufacturing method thereof | Cheng-Yen Hsieh | 2020-12-15 |
| 10833033 | Bump structure having a side recess and semiconductor structure including the same | Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin | 2020-11-10 |
| 10811338 | Surface treatment method and apparatus for semiconductor packaging | Jie Deng, Tin-Hao Kuo, Ying-Yu Chen | 2020-10-20 |