Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Ching-Feng Yang +2 more | 2020-12-15 |
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Shih-Wei Liang
Overall (2020): #275,600 of 565,922Top 50%
1
Patents 2020