Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Ching-Feng Yang +2 more | 2020-12-15 |
| 10770313 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chung-Hao Tsai, Chun-Lin Lu, Che-Wei Hsu | 2020-09-08 |
| 10748861 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Han-Ping Pu | 2020-08-18 |
| 10727082 | Semiconductor device and manufacturing method thereof | Shou-Zen Chang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen +3 more | 2020-07-28 |