MH

Min-Chien Hsiao

TSMC: 1 patents #1,818 of 3,471Top 55%
Overall (2020): #346,526 of 565,922Top 65%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10535913 Package structure, electronic device and method of fabricating package structure Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang 2020-01-14