Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872885 | Integrated circuit packages and methods of forming same | Hung-Jui Kuo, Ming-Che Ho | 2020-12-22 |
| 10867941 | Semiconductor device and method | Chen-Hua Yu, Ming-Che Ho, Hung-Jui Kuo, Tzung-Hui Lee | 2020-12-15 |
| 10840212 | Bonding package components through plating | Zheng-Yi Lim, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu | 2020-11-17 |
| 10734341 | Via structure for packaging and a method of forming | Ming-Che Ho, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu | 2020-08-04 |
| 10700001 | Forming bonding structures by using template layer as templates | Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky +3 more | 2020-06-30 |