Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840212 | Bonding package components through plating | Zheng-Yi Lim, Yi-Wen Wu, Ming-Che Ho, Chung-Shi Liu | 2020-11-17 |
TY
Tzong-Hann Yang
Overall (2020): #236,470 of 565,922Top 45%
1
Patents 2020