Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777431 | Post-passivation interconnect structure and method of forming the same | Hung-Jen Lin, Tsung-Ding Wang | 2020-09-15 |
| 10665565 | Package assembly | Hung-Jen Lin, Tsung-Ding Wang, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2020-05-26 |