Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867947 | Semiconductor packages and methods of manufacturing the same | Jiun Yi Wu, Chen-Hua Yu | 2020-12-15 |
| 10804192 | Protrusion bump pads for bond-on-trace processing | Jiun Yi Wu | 2020-10-13 |
| 10804245 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Chin-Liang Chen | 2020-10-13 |
| 10790210 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chien-Hsun Lee | 2020-09-29 |
| 10700034 | Protrusion bump pads for bond-on-trace processing | Jiun Yi Wu | 2020-06-30 |
| 10700031 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho | 2020-06-30 |
| 10658263 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Wen-Lin Chen | 2020-05-19 |
| 10622278 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Chi-Yang Yu, Kuan-Lin Ho | 2020-04-14 |