Issued Patents 2020
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867947 | Semiconductor packages and methods of manufacturing the same | Chen-Hua Yu, Yu-Min Liang | 2020-12-15 |
| 10869385 | Semiconductor device, circuit board structure and method of fabricating the same | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2020-12-15 |
| 10867982 | Hybrid integrated circuit package and method | Chen-Hua Yu, Hsing-Kuo Hsia | 2020-12-15 |
| 10861836 | Interposer frame and method of manufacturing the same | — | 2020-12-08 |
| 10854552 | Semiconductor device and method of manufacture | Chen-Hua Yu, Chung-Shi Liu, Chien-Hsun Lee | 2020-12-01 |
| 10840224 | Interposer frame and method of manufacturing the same | — | 2020-11-17 |
| 10804192 | Protrusion bump pads for bond-on-trace processing | Yu-Min Liang | 2020-10-13 |
| 10785865 | Interconnect structure and method of manufacturing the same | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2020-09-22 |
| 10772205 | Circuit board, semiconductor device including the same, and manufacturing method thereof | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2020-09-08 |
| 10700034 | Protrusion bump pads for bond-on-trace processing | Yu-Min Liang | 2020-06-30 |
| 10672751 | Contoured package-on-package joint | — | 2020-06-02 |
| 10665520 | Integrated circuit package and method | Chien-Hsun Chen, Yu-Ling Tsai, Chien-Hsun Lee, Chung-Shi Liu | 2020-05-26 |
| 10638616 | Circuit carrier and manifacturing method thereof | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2020-04-28 |
| 10629579 | Package-on-package with cavity in interposer | — | 2020-04-21 |
| 10555424 | Circuit board, semiconductor device including the same, and manufacturing method thereof | Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu | 2020-02-04 |
| 10530030 | Semiconductor device having first and second transmission lines with a high-K dielectric material disposed between the first and second transmission lines | Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh | 2020-01-07 |