Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879140 | System and method for bonding package lid | Shih-Yen Lin, Yu-Chih Liu, Chin-Liang Chen, Wei-Ting Lin | 2020-12-29 |
| 10867835 | Semiconductor packaging structure and process | Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Shih-Yen Lin | 2020-12-15 |
| 10804245 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang | 2020-10-13 |
| 10777467 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chien-Kuo Chang, Chih-Hao Lin, Jung-Tsung Cheng | 2020-09-15 |
| 10700031 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Yu-Min Liang | 2020-06-30 |
| 10685853 | Lid attach processes for semiconductor packages | Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Jason Shen | 2020-06-16 |
| 10658263 | Semiconductor package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Yu-Min Liang, Wen-Lin Chen | 2020-05-19 |
| 10622278 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang | 2020-04-14 |