Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879140 | System and method for bonding package lid | Yu-Chih Liu, Chin-Liang Chen, Wei-Ting Lin, Kuan-Lin Ho | 2020-12-29 |
| 10872973 | Semiconductor structures with two-dimensional materials | Hsuan-An Chen | 2020-12-22 |
| 10867835 | Semiconductor packaging structure and process | Kuan-Lin Ho, Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu | 2020-12-15 |
| 10784351 | 2D crystal hetero-structures and manufacturing methods thereof | Si-Chen Lee, Samuel C. Pan, Kuan-Chao CHEN | 2020-09-22 |
| 10636652 | Method of forming a semiconductor device using layered etching and repairing of damaged portions | Kuan-Chao CHEN, Si-Chen Lee, Samuel C. Pan | 2020-04-28 |
| 10541132 | Forming semiconductor structures with two-dimensional materials | Hsuan-An Chen, Si-Chen Lee | 2020-01-21 |