Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879140 | System and method for bonding package lid | Shih-Yen Lin, Yu-Chih Liu, Chin-Liang Chen, Kuan-Lin Ho | 2020-12-29 |
| 10867835 | Semiconductor packaging structure and process | Kuan-Lin Ho, Chin-Liang Chen, Yu-Chih Liu, Shih-Yen Lin | 2020-12-15 |
| 10727082 | Semiconductor device and manufacturing method thereof | Shou-Zen Chang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen +3 more | 2020-07-28 |
| 10685853 | Lid attach processes for semiconductor packages | Chin-Liang Chen, Yu-Chih Liu, Kuan-Lin Ho, Jason Shen | 2020-06-16 |
| 10534345 | Spindle with intelligent auto-detection system | — | 2020-01-14 |