Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879140 | System and method for bonding package lid | Shih-Yen Lin, Chin-Liang Chen, Wei-Ting Lin, Kuan-Lin Ho | 2020-12-29 |
| 10867835 | Semiconductor packaging structure and process | Kuan-Lin Ho, Chin-Liang Chen, Wei-Ting Lin, Shih-Yen Lin | 2020-12-15 |
| 10825807 | Electrostatic protection circuit, array substrate, display panel and display device | Yanwei Ren, Jingyi Xu, Kunpeng Zhang, Min Liu, Ruiying Tian | 2020-11-03 |
| 10789446 | Device for fingerprint recognition, manufacturing method therefor, and electronic apparatus | Ting Tian, Ming Zhai, Shuqian Dou, Xiaoliang Fu, Dayong Zhou +9 more | 2020-09-29 |
| 10775167 | Sensing single mode optical fiber, tilt angle sensor and preparation method thereof | Ming Zhai, Xiaoliang Fu | 2020-09-15 |
| 10757848 | Display device and manufacturing method thereof | Jingyi Xu, Xin Li, Kunpeng Zhang, Yi Fan, Yanwei Ren +1 more | 2020-08-25 |
| 10685853 | Lid attach processes for semiconductor packages | Chin-Liang Chen, Wei-Ting Lin, Kuan-Lin Ho, Jason Shen | 2020-06-16 |