Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777467 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Chih-Hao Lin, Jung-Tsung Cheng, Kuan-Lin Ho | 2020-09-15 |
| 10700030 | Semiconductor package having varying conductive pad sizes | Chih-Hao Lin, Tzu-Kai Lan, Chung-Chih Chen, Jr-Lin Hsu | 2020-06-30 |
| D873586 | Table | — | 2020-01-28 |