Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872831 | Method of forming a semiconductor package | Ying-Shin Han, Yen-Miao LIN, Hsien-Liang Meng | 2020-12-22 |
| 10700030 | Semiconductor package having varying conductive pad sizes | Chih-Hao Lin, Chien-Kuo Chang, Tzu-Kai Lan, Jr-Lin Hsu | 2020-06-30 |
| 10601677 | Device and method for a dynamic virtual private network and computer readable recording medium | Shi-Ming Zhao | 2020-03-24 |