Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872831 | Method of forming a semiconductor package | Ying-Shin Han, Yen-Miao LIN, Chung-Chih Chen | 2020-12-22 |
HM
Hsien-Liang Meng
Overall (2020): #445,120 of 565,922Top 80%
1
Patents 2020