Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872831 | Method of forming a semiconductor package | Yen-Miao LIN, Chung-Chih Chen, Hsien-Liang Meng | 2020-12-22 |
| 10867951 | Semiconductor device | Kuan-Yu Huang, Tzu-Kai Lan, Shou-Chih Yin, Shu-Chia Hsu, Pai Yuan Li +2 more | 2020-12-15 |