Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872871 | Chip package structure with dummy bump and method for forming the same | Sung-Hui Huang, Kuan-Yu Huang, Shang-Yun Hou, Yushun Lin, Heh-Chang Huang +2 more | 2020-12-22 |
| 10867951 | Semiconductor device | Kuan-Yu Huang, Tzu-Kai Lan, Shou-Chih Yin, Shu-Chia Hsu, Sung-Hui Huang +2 more | 2020-12-15 |
| 10770405 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Hsiang-Fan Lee | 2020-09-08 |
| 10707177 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Hsiang-Fan Lee | 2020-07-07 |
| 10629545 | Semiconductor device | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Hsiang-Fan Lee, Szu-Po Huang | 2020-04-21 |