Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629510 | Package with embedded heat dissipation features | Wensen Hung, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2020-04-21 |
| 10629545 | Semiconductor device | Kuan-Yu Huang, Sung-Hui Huang, Pai Yuan Li, Shu-Chia Hsu, Hsiang-Fan Lee | 2020-04-21 |