Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629510 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Chi-Hsi Wu, Shin-Puu Jeng | 2020-04-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629510 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Chi-Hsi Wu, Shin-Puu Jeng | 2020-04-21 |