Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879199 | Method of manufacturing semiconductor package | Hung-Jui Kuo, Jyun-Siang Peng | 2020-12-29 |
| 10879161 | Semiconductor packages having a seed layer structure protruding from an edge of metal structure | Hung-Jui Kuo, Jyun-Siang Peng, Chien-Tang Peng | 2020-12-29 |
| 10867827 | Alignment holder, testing apparatus and method for manufacturing a semiconductor package | Chih-Yu Wang, Hung-Jui Kuo | 2020-12-15 |
| 10867874 | Semiconductor device and method | Chen-Hua Yu, Yun Chen Hsieh, Hung-Jui Kuo | 2020-12-15 |
| 10854570 | Integrated fan-out package and method of fabricating the same | Hung-Jui Kuo, Jyun-Siang Peng | 2020-12-01 |
| 10847429 | Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus | Hung-Jui Kuo, Chih-Yu Wang | 2020-11-24 |
| 10840129 | Semiconductor package and method | Hung-Jui Kuo, Yun Chen Hsieh | 2020-11-17 |
| 10707094 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo +1 more | 2020-07-07 |
| 10629540 | Semiconductor device and method | Chen-Hua Yu, Hung-Jui Kuo, Chung-Shi Liu, Han-Ping Pu, Ting-Chu Ko | 2020-04-21 |
| 10622321 | Semiconductor structures and methods of forming the same | Chen-Hua Yu, Hung-Jui Kuo, Tsao-Lun Chang | 2020-04-14 |