Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879161 | Semiconductor packages having a seed layer structure protruding from an edge of metal structure | Hung-Jui Kuo, Hui-Jung Tsai, Jyun-Siang Peng | 2020-12-29 |
CP
Chien-Tang Peng
Overall (2020): #513,600 of 565,922Top 95%
1
Patents 2020