Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879161 | Semiconductor packages having a seed layer structure protruding from an edge of metal structure | Hung-Jui Kuo, Hui-Jung Tsai, Chien-Tang Peng | 2020-12-29 |
| 10879199 | Method of manufacturing semiconductor package | Hung-Jui Kuo, Hui-Jung Tsai | 2020-12-29 |
| 10854570 | Integrated fan-out package and method of fabricating the same | Hui-Jung Tsai, Hung-Jui Kuo | 2020-12-01 |