Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685920 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Po-Yao Lin, Kuo-Chuan Liu | 2020-06-16 |
| 10643951 | Mini identification mark in die-less region of semiconductor wafer | Yue-Lin Peng, Cheng-Yi Huang, Shou-Wen Kuo | 2020-05-05 |