Issued Patents 2020
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727198 | Semiconductor package and method manufacturing the same | Feng-Cheng Hsu | 2020-07-28 |
| 10727147 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Po-Yao Lin, Shyue-Ter Leu, Chih-Kung Huang, Tsung-Ming Yeh | 2020-07-28 |
| 10714463 | Method of forming semicondcutor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shu-Shen Yeh +1 more | 2020-07-14 |
| 10707142 | Semiconductor package and method manufacturing the same | Feng-Cheng Hsu | 2020-07-07 |
| 10692764 | Alignment marks in substrate having through-substrate via (TSV) | Hsin Chang, Fang Wen Tsai, Jing-Cheng Lin, Wen-Chih Chiou | 2020-06-23 |
| 10692813 | Semiconductor package with dummy bumps connected to non-solder mask defined pads | Feng-Cheng Hsu | 2020-06-23 |
| 10679951 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2020-06-09 |
| 10665474 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou | 2020-05-26 |
| 10665559 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Lin | 2020-05-26 |
| 10665473 | Package structure and method of fabricating the same | Chia-Hsiang Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Arunima Banerjee | 2020-05-26 |
| 10663512 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Chen-Hua Yu, Chao-Hsiang Yang | 2020-05-26 |
| 10658337 | Packages and packaging methods for semiconductor devices, and packaged semiconductor devices | Chen-Hua Yu, Hsien-Wei Chen, Der-Chyang Yeh, An-Jhih Su | 2020-05-19 |
| 10636747 | Semiconductor package structure | Jui-Pin Hung, Feng-Cheng Hsu, Shuo-Mao Chen, De-Dui Liao | 2020-04-28 |
| 10629510 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu | 2020-04-21 |
| 10622336 | Manufacturing method of semiconductor package | Feng-Cheng Hsu, Jui-Pin Hung | 2020-04-14 |
| 10566237 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang +3 more | 2020-02-18 |
| 10546830 | Chip package structure | Shuo-Mao Chen, Feng-Cheng Hsu | 2020-01-28 |
| 10535597 | Semiconductor structure and manufacturing method thereof | Shuo-Mao Chen, Feng-Cheng Hsu | 2020-01-14 |
| 10535632 | Semiconductor package structure and method of manufacturing the same | Feng-Cheng Hsu, Shuo-Mao Chen | 2020-01-14 |
| 10529671 | Package structure and method for forming the same | Hsiao-Wen Lee, Hsien-Wen Liu | 2020-01-07 |
| 10529679 | 3D packages and methods for forming the same | Shang-Yun Hou, Sao-Ling Chiu, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou +1 more | 2020-01-07 |