Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867939 | Package structure and method of fabricating the same | Cheng-Yu Kuo, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Wei Huang | 2020-12-15 |
| 10790252 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Szu-Yu Yeh, Yu-Ren Chen, Hung-Jui Kuo, Chung-Shi Liu | 2020-09-29 |
| 10535629 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang, Ching-Hua Hsieh +9 more | 2020-01-14 |