Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867939 | Package structure and method of fabricating the same | Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Yi-Yang Lei, Wei Huang | 2020-12-15 |
| 10535629 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Tsung Lung Huang, Ching-Hua Hsieh +9 more | 2020-01-14 |