Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861761 | Semiconductor packaged wafer and method for forming the same | Fu-Chen Chang, Cheng-Lin Huang, Wen-Ming Chen, Shih-Yen Chen, Ruei-Yi Tsai | 2020-12-08 |
| 10665489 | Integrated chip die carrier exchanger | Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo, Patrick Lin | 2020-05-26 |