Issued Patents 2020
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10546845 | Package on package structure | Dong Shen, Kuo-Chio Liu, Hsi-Kuei Cheng, Yi-Jen Lai | 2020-01-28 |
| 10535593 | Package structure having a plurality of conductive balls with narrow width for ball waist | Pi-Lan Chang, Chin-Yu Ku, Hsu-Hsien Chen, Wei-Chih Huang, Chun-Ying Lin +1 more | 2020-01-14 |