Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867932 | Method for manufacturing package structure | Yi-Da Tsai, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2020-12-15 |
| 10535609 | Package structure and method for forming the same | Yi-Da Tsai, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2020-01-14 |