Issued Patents 2020
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553561 | Mechanisms of forming connectors for package on package | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Kai-Chiang Wu | 2020-02-04 |
| 10535616 | Warpage control in package-on-package structures | Wei-Yu Chen, Yu-Hsiang Hu, Wei-Hung Lin, Chung-Shi Liu | 2020-01-14 |
| 10535609 | Package structure and method for forming the same | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ching-Hua Hsieh +1 more | 2020-01-14 |