Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700010 | Copper contact plugs with barrier layers | Ching-Hua Hsieh, Huang-Ming Chen, Hsueh Wen Tsau | 2020-06-30 |
| 10534273 | Multi-metal fill with self-aligned patterning and dielectric with voids | Tai-I Yang, Wei-Chen Chu, Hsiang-Wei Liu, Shau-Lin Shue, Yung-Hsu Wu | 2020-01-14 |