Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818596 | Method for forming semiconductor device structure with graphene layer | Tai-I Yang, Tien-I Bao, Tien-Lu Lin | 2020-10-27 |
| 10804143 | Semiconductor structure and method for manufacturing the same | Tai-I Yang, Hsin-Ping Chen, Chih Wei Lu, Chung-Ju Lee | 2020-10-13 |
| 10784151 | Interconnect structure and manufacturing method for the same | Hsiang-Wei Liu, Chia-Tien Wu, Tai-I Yang | 2020-09-22 |
| 10784155 | Multi-metal fill with self-align patterning | Tai-I Yang, Cheng-Chi Chuang, Chia-Tien Wu | 2020-09-22 |
| 10734275 | Metal routing with flexible space formed using self-aligned spacer patterning | Hsiang-Wei Liu, Chia-Tien Wu | 2020-08-04 |
| 10714421 | Structure and formation method of semiconductor device with self-aligned conductive features | Tai-I Yang, Yung-Hsu Wu, Chung-Ju Lee | 2020-07-14 |
| 10535560 | Interconnection structure of semiconductor device | Hsiang-Wei Liu, Tai-I Yang, Chia-Tien Wu | 2020-01-14 |
| 10534273 | Multi-metal fill with self-aligned patterning and dielectric with voids | Tai-I Yang, Hsiang-Wei Liu, Shau-Lin Shue, Li-Lin Su, Yung-Hsu Wu | 2020-01-14 |
| 10529617 | Metal routing with flexible space formed using self-aligned spacer patterning | Hsiang-Wei Liu, Chia-Tien Wu | 2020-01-07 |