Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879120 | Self aligned via and method for fabricating the same | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +4 more | 2020-12-29 |
| 10847460 | Advanced metal connection with metal cut | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Charles Chew-Yuen Young, Hui-Ting Yang +6 more | 2020-11-24 |
| 10847418 | Formation method of damascene structure | Tai-Yen Peng, Jye-Yen Cheng | 2020-11-24 |
| 10818509 | Method of fabricating semiconductor device with reduced trench distortions | Yung-Sung Yen, Chung-Ju Lee, Chun-Kuang Chen, Ta-Ching Yu, Kuei-Shun Chen +4 more | 2020-10-27 |
| 10784155 | Multi-metal fill with self-align patterning | Wei-Chen Chu, Tai-I Yang, Cheng-Chi Chuang | 2020-09-22 |
| 10784151 | Interconnect structure and manufacturing method for the same | Hsiang-Wei Liu, Wei-Chen Chu, Tai-I Yang | 2020-09-22 |
| 10777452 | Interconnection structure having top and bottom vias with a barrier layer therebetween and a dielectric spacer at the bottom via | Po-Kuan HO | 2020-09-15 |
| 10734275 | Metal routing with flexible space formed using self-aligned spacer patterning | Hsiang-Wei Liu, Wei-Chen Chu | 2020-08-04 |
| 10535560 | Interconnection structure of semiconductor device | Wei-Chen Chu, Hsiang-Wei Liu, Tai-I Yang | 2020-01-14 |
| 10529617 | Metal routing with flexible space formed using self-aligned spacer patterning | Hsiang-Wei Liu, Wei-Chen Chu | 2020-01-07 |