Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777452 | Interconnection structure having top and bottom vias with a barrier layer therebetween and a dielectric spacer at the bottom via | Chia-Tien Wu | 2020-09-15 |
PH
Po-Kuan HO
Overall (2020): #312,919 of 565,922Top 60%
1
Patents 2020