Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10878162 | Metal with buried power for increased IC device density | Shih-Wei Peng, Chih-Ming Lai, Jiann-Tyng Tzeng, Wei-Cheng Lin | 2020-12-29 |
| 10878158 | Semiconductor device including cell region having more similar cell densities in different height rows, and method and system for generating layout diagram of same | Wei-Cheng Lin, Jiann-Tyng Tzeng, Lipen Yuan, Wei-An Lai | 2020-12-29 |
| 10867917 | Semiconductor device, associated method and layout | Shih-Wei Peng, Wei-Cheng Lin, Jiann-Tyng Tzeng | 2020-12-15 |
| 10843455 | Method and apparatus for curing inks printed on heat sensitive absorbent article components | John Andrew Strasemeier | 2020-11-24 |
| 10847460 | Advanced metal connection with metal cut | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young +6 more | 2020-11-24 |
| 10804402 | Metal rail conductors for non-planar semiconductor devices | Chih-Liang Chen, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio, Shih-Wei Peng +2 more | 2020-10-13 |
| 10784168 | Dummy MOL removal for performance enhancement | Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +4 more | 2020-09-22 |
| 10700207 | Semiconductor device integrating backside power grid and related integrated circuit and fabrication method | Chih-Liang Chen, Lei-Chun Chou, Jack Liu, Kam-Tou Sio, Wei-Cheng Lin +3 more | 2020-06-30 |
| 10658292 | Metal patterning for internal cell routing | Shih-Wei Peng, Chih-Liang Chen, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Wei-Cheng Lin | 2020-05-19 |