Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879120 | Self aligned via and method for fabricating the same | Chih-Liang Chen, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +4 more | 2020-12-29 |
| 10847460 | Advanced metal connection with metal cut | Chih-Liang Chen, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang +6 more | 2020-11-24 |
| 10818597 | Hybrid copper structure for advance interconnect usage | Hsiang-Wei Liu, Tai-I Yang, Tien-Lu Lin | 2020-10-27 |
| 10784869 | Integrated circuit and method of manufacturing the same | Shih-Wei Peng, Chih-Ming Lai, Jiann-Tyng Tzeng, Wei-Cheng Lin | 2020-09-22 |
| 10784155 | Multi-metal fill with self-align patterning | Wei-Chen Chu, Tai-I Yang, Chia-Tien Wu | 2020-09-22 |
| 10727113 | Methods of forming metal layer structures in semiconductor devices | Ethan Hsiao, Chien-Wen Lai, Chih-Ming Lai, Yi-Hsiung Lin, Hsin-Ping Chen +1 more | 2020-07-28 |
| 10700005 | Interconnect structure with air gaps | Tai-I Yang, Yung-Chih Wang, Tien-Lu Lin | 2020-06-30 |