Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818597 | Hybrid copper structure for advance interconnect usage | Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin | 2020-10-27 |
| 10784151 | Interconnect structure and manufacturing method for the same | Wei-Chen Chu, Chia-Tien Wu, Tai-I Yang | 2020-09-22 |
| 10734275 | Metal routing with flexible space formed using self-aligned spacer patterning | Chia-Tien Wu, Wei-Chen Chu | 2020-08-04 |
| 10658296 | Dielectric film for semiconductor fabrication | Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang +1 more | 2020-05-19 |
| 10535560 | Interconnection structure of semiconductor device | Wei-Chen Chu, Tai-I Yang, Chia-Tien Wu | 2020-01-14 |
| 10534273 | Multi-metal fill with self-aligned patterning and dielectric with voids | Tai-I Yang, Wei-Chen Chu, Shau-Lin Shue, Li-Lin Su, Yung-Hsu Wu | 2020-01-14 |
| 10529617 | Metal routing with flexible space formed using self-aligned spacer patterning | Chia-Tien Wu, Wei-Chen Chu | 2020-01-07 |