Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867913 | Method and apparatus for forming self-aligned via with selectively deposited etching stop layer | Hai-Ching Chen, Jung-Hsun Tsai, Shau-Lin Shue, Tien-I Bao | 2020-12-15 |
| 10818509 | Method of fabricating semiconductor device with reduced trench distortions | Yung-Sung Yen, Chung-Ju Lee, Chun-Kuang Chen, Chia-Tien Wu, Ta-Ching Yu +4 more | 2020-10-27 |
| 10784160 | Semiconductor device having voids and method of forming same | Chien-Hua Huang, Chung-Ju Lee, Tien-I Bao, Shau-Lin Shue | 2020-09-22 |
| 10714421 | Structure and formation method of semiconductor device with self-aligned conductive features | Tai-I Yang, Wei-Chen Chu, Chung-Ju Lee | 2020-07-14 |
| 10534273 | Multi-metal fill with self-aligned patterning and dielectric with voids | Tai-I Yang, Wei-Chen Chu, Hsiang-Wei Liu, Shau-Lin Shue, Li-Lin Su | 2020-01-14 |