Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879176 | Integrated circuit structure | Shang-Wen Chang, Yi-Hsun Chiu | 2020-12-29 |
| 10818473 | Implanter calibration | Cheng-En Lee, Chia-Lin Ou, Hsuan-Pang Liu, Yao-Jen Yeh | 2020-10-27 |
| 10763198 | Monolithic 3D integration inter-tier vias insertion scheme and associated layout structure | Ta-Pen Guo, Carlos H. Diaz, Jean-Pierre Colinge | 2020-09-01 |
| 10763365 | Metal rail conductors for non-planar semiconductor devices | Chih-Liang Chen, Chih-Ming Lai, Ching-Wei Tsai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +5 more | 2020-09-01 |
| 10734321 | Integrated circuit and method of manufacturing same | Pochun Wang, Ting-Wei Chiang, Chih-Ming Lai, Hui-Zhong Zhuang, Jung-Chan Yang +6 more | 2020-08-04 |
| 10727113 | Methods of forming metal layer structures in semiconductor devices | Ethan Hsiao, Chien-Wen Lai, Chih-Ming Lai, Cheng-Chi Chuang, Hsin-Ping Chen +1 more | 2020-07-28 |
| 10672665 | Fin field effect transistor device structure and method for forming the same | Shang-Wen Chang, Yi-Hsun Chiu | 2020-06-02 |