Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763164 | Package structure with inductor and method of forming thereof | Chung-Hao Tsai, Jeng-Shien Hsieh, Chuei-Tang Wang, Chen-Hua Yu, Chih-Yuan Chang | 2020-09-01 |
| 10559517 | Heat transfer structures and methods for IC packages | Ying-Chih Hsu, Alan Roth, Chuei-Tang Wang, Chih-Yuan Chang, Eric Soenen | 2020-02-11 |
| 10535635 | Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductor | Chin-Chou Liu, Fong-Yuan Chang, Hui Yu Lee, Po-Hsiang Huang | 2020-01-14 |