Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10559517 | Heat transfer structures and methods for IC packages | Alan Roth, Chuei-Tang Wang, Chih-Yuan Chang, Eric Soenen, Chih-Lin Chen | 2020-02-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10559517 | Heat transfer structures and methods for IC packages | Alan Roth, Chuei-Tang Wang, Chih-Yuan Chang, Eric Soenen, Chih-Lin Chen | 2020-02-11 |