Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763253 | Structure and method for cooling three-dimensional integrated circuits | Chi-Wen Chang, Jui-Feng Kuan, Yi-Kan Cheng | 2020-09-01 |
| 10665550 | Electromagnetic shielding metal-insulator-metal capacitor structure | Chin-Chou Liu, Cheng-Hung Yeh, Fong-Yuan Chang, Po-Hsiang Huang, Yi-Kan Cheng +1 more | 2020-05-26 |
| 10634972 | Configurable heating device and method of using the same | Jui-Feng Kuan | 2020-04-28 |
| 10638543 | Photonic heater | — | 2020-04-28 |
| 10540475 | System for manufacturing a semiconductor device | Chi-Wen Chang, Ya Yun Liu, Jui-Feng Kuan, Yi-Kan Cheng | 2020-01-21 |
| 10535635 | Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductor | Chih-Lin Chen, Chin-Chou Liu, Fong-Yuan Chang, Po-Hsiang Huang | 2020-01-14 |