Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763253 | Structure and method for cooling three-dimensional integrated circuits | Hui Yu Lee, Chi-Wen Chang, Yi-Kan Cheng | 2020-09-01 |
| 10719652 | Electromigration sign-off tool | Yu-Tseng Hsien, Chin-Shen Lin, Ching-Shun Yang | 2020-07-21 |
| 10685161 | Region based shrinking methodology for integrated circuit layout migration | Chi-Wen Chang | 2020-06-16 |
| 10634972 | Configurable heating device and method of using the same | Hui Yu Lee | 2020-04-28 |
| 10540475 | System for manufacturing a semiconductor device | Chi-Wen Chang, Hui Yu Lee, Ya Yun Liu, Yi-Kan Cheng | 2020-01-21 |