Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867916 | Via sizing for IR drop reduction | Hiranmay Biswas, Kuo-Nan Yang, Chung-Hsing Wang | 2020-12-15 |
| 10726174 | System and method for simulating reliability of circuit design | Meng-Xiang Lee, Kuo-Nan Yang, Chung-Hsing Wang | 2020-07-28 |
| 10719652 | Electromigration sign-off tool | Yu-Tseng Hsien, Ching-Shun Yang, Jui-Feng Kuan | 2020-07-21 |