Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763253 | Structure and method for cooling three-dimensional integrated circuits | Hui Yu Lee, Jui-Feng Kuan, Yi-Kan Cheng | 2020-09-01 |
| 10685161 | Region based shrinking methodology for integrated circuit layout migration | Jui-Feng Kuan | 2020-06-16 |
| 10540475 | System for manufacturing a semiconductor device | Hui Yu Lee, Ya Yun Liu, Jui-Feng Kuan, Yi-Kan Cheng | 2020-01-21 |